KUKA SYSTEMS KS UTG 156.1

Product Briefing Outline:

KUKA Systems’ Energy Team has designed a new generation of wafer gripping solutions which is based on KUKA’s top selling KR Sixx and Scara Robots

Problem

The PV industry is striving for thinner wafers and high efficiency photovoltaic cells in addition to the need for higher automation and reliability.

Solution

High Speed Ultra Thin Gripper

This extremely thin and robust solution made of carbon fibre allows high speed gripping and precise positioning at one time. Integrated multiple vacuum channels ensure firmly gripping of the wafers for fast movement and soft holding for accurate positioning.

By using carbon fibre, a gripper thickness of 3 mm is made possible. Hence single wafers or cells can be picked from carriers from any position.

Touchless Gripping and Transport

KUKA relies on the solution of German Zimmermann & Schilp combining ultrasound with vacuum technology: An ultrasonic cushion ensures non-contact gripping and avoids wafer warp and vibration while fast and accurate pick and place operations are carried out.

By touching the cell from only one side the edge contact is minimized during the whole transport. It features low energy consumption as well as a high throughput: cycle time is less than one second per wafer.

Application

Both solutions are designed for robustness and reliability which are basic requirements for the needs of high automation. Due to a very low demand of compressed and cleaned air the systems have a large advantage compared to other solutions based on the Bernoulli technology. Due to the non-contact gripping the need of repair or spare parts is limited to a minimum as suction cups or cushions are no longer in direct touch with the cells or wafers. Hence costs for spare parts and services remain at a low level.