amb apparate- + maschinenbau gmbh Wet Wafer Separator 3000+

Product Briefing

High throughput, reduced breakage rate and a high level of reliability are features of the new separating system WWS 3000+. Even thinnest wafers are handled safely and reliably by gentle separation of the wafers from the stack in the water bath.

Problem

The Wet Wafer Separator 3000+ addresses the critical handling of wafers. Reduced breakage rates and high throughput are the main focus of the WWS 3000+

Solution

The loaded carriers are lowered into a water bath. A feeder system brings the stack of wafers automatically to the pickup point. A newly developed pickup system separates the foremost wafer from the stack without any mecanical stress which results in reduced breakage rates. After separation, the wafers are moved out of the water bath to the transfer station along a special conveyer belt with a non-slip surface.The belt creates a large surface contact with the wafers which guarantees a gentle transport.

Applications

Wafer type: Multi- and Mono-crystalline silicon.
Wafer geometry: Square and pseudo-square
Wafer thickness: 150 - 300 micro meters

Platform

With the technology used in the system, wafer damage and breakage is reduced to a minimum. High efficiency separating unit, combined with wafer control units and buffer systems, guarantee high production and yield.

Availability

End of 2008

Contact:

amb apparate- + maschinenbau gmbh
dieselstrasse 10-11
d - 86368 gersthofen

Wichard von Grotthuss
Tel:      +49 (0) 821 24177- 50
mobil: +49 (0)160 9674 6000
fax:      +49 (0) 821 24177- 750
mail:    wvg@amb-automation.de
net:      www.amb-automation.de